HiSilicon Kirin 810

HiSilicon Kirin 810

HiSilicon Kirin 810 review: specs and price

HiSilicon Kirin 810

Why is HiSilicon Kirin 810 better than the average?

  • CPU speed

    2 x 2.27GHz & 6 x 1.88GHzvs8.7GHz
  • RAM speed

  • Semiconductor size

  • GPU clock speed

  • Download speed

  • Maximum memory bandwidth

  • DirectX version

  • Memory channels


Price comparison

HiSilicon Kirin 810

Buy used:


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General info

1.Has integrated graphics
HiSilicon Kirin 810
With integrated graphics you don’t need to buy a separate graphics card.
2.Supports 64-bit
HiSilicon Kirin 810
A 32-bit operating system can only support up to 4GB of RAM. 64-bit allows more than 4GB, giving increased performance. It also allows you to run 64-bit apps.
3.semiconductor size


Small semiconductors provide better performance and reduced power consumption. Chipsets with a higher number of transistors, semiconductor components of electronic devices, offer more computational power. A small form factor allows more transistors to fit on a chip, therefore increasing its performance.
4.GPU clock speed


The graphics processing unit (GPU) has a higher clock speed.
5.DirectX version


DirectX is used in games, with newer versions supporting better graphics.
6.OpenGL ES version


OpenGL ES is used for games on mobile devices such as smartphones. Newer versions support better graphics.


1.CPU speed

2 x 2.27GHz & 6 x 1.88GHz

The CPU speed indicates how many processing cycles per second can be executed by a CPU, considering all of its cores (processing units). It is calculated by adding the clock rates of each core or, in the case of multi-core processors employing different microarchitectures, of each group of cores.
2.Uses big.LITTLE technology
HiSilicon Kirin 810
Using big.LITTLE technology, a chip can switch between two sets of processor cores to maximize performance and battery life. For example, when playing a game the more powerful cores will be used to increase performance, whereas checking email will use the less powerful cores to maximize battery life.
3.L1 cache


A larger L1 cache results in faster CPU and system-wide performance.


1.RAM speed


It can support faster memory, which will give quicker system performance.
2.maximum memory bandwidth


This is the maximum rate that data can be read from or stored into memory.
3.memory channels


More memory channels increases the speed of data transfer between the memory and the CPU.
4.maximum memory size


The maximum amount of memory (RAM) supported.
5.Supports ECC memory
HiSilicon Kirin 810
Error-correcting code memory can detect and correct data corruption. It is used when is it essential to avoid corruption, such as scientific computing or when running a server.


1.Has integrated LTE
HiSilicon Kirin 810
The system on a chip (SoC) has an integrated LTE cellular chip. LTE is capable of downloading at faster speeds than older, 3G technology.
2.Has dynamic frequency scaling
HiSilicon Kirin 810
Dynamic frequency scaling is a technology that allows the processor to conserve power and reduce noise when it is under a light load.
3.download speed


The download speed is a measurement of the internet connection bandwidth, representing the maximum data transfer rate at which a device can access online content.
4.Has NX bit
HiSilicon Kirin 810
NX bit helps protect the computer from malicious attacks.
5.Supports hardware-assisted virtualization
HiSilicon Kirin 810 (ARM Cortex-A55)
It is easier to obtain better performance when using virtualization if it is hardware-assisted.
6.Has AES
HiSilicon Kirin 810 (ARM Cortex-A55)
AES is used to speed up encryption and decryption.

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