1.Thermal Design Power (TDP)
The thermal design power (TDP) is the maximum amount of power the cooling system needs to dissipate. A lower TDP typically means that it consumes less power.
A higher transistor count generally indicates a newer, more powerful processor.
Small semiconductors provide better performance and reduced power consumption. Chipsets with a higher number of transistors, semiconductor components of electronic devices, offer more computational power. A small form factor allows more transistors to fit on a chip, therefore increasing its performance.
4.PCI Express (PCIe) version
Peripheral Component Interconnect Express (PCIe) is a high-speed interface standard for connecting components, such as graphics cards and SSDs, to a motherboard. Newer versions can support more bandwidth and deliver better performance.
The width represents the horizontal dimension of the product. We consider a smaller width better because it assures easy maneuverability.
The height represents the vertical dimension of the product. We consider a smaller height better because it assures easy maneuverability.