1.Thermal Design Power (TDP)
The thermal design power (TDP) is the maximum amount of power the cooling system needs to dissipate. A lower TDP typically means that it consumes less power.
A higher transistor count generally indicates a newer, more powerful processor.
Small semiconductors provide better performance and reduced power consumption. Chipsets with a higher number of transistors, semiconductor components of electronic devices, offer more computational power. A small form factor allows more transistors to fit on a chip, therefore increasing its performance.
4.PCI Express (PCIe) version
Peripheral Component Interconnect Express (PCIe) is a high-speed interface standard for connecting components, such as graphics cards and SSDs, to a motherboard. Newer versions can support more bandwidth and deliver better performance.
The graphics card uses a combination of water and air to reduce the temperature of the card. This allows it to be overclocked more, increasing performance.
The width represents the horizontal dimension of the product. We consider a smaller width better because it assures easy maneuverability.